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2D QUANTUM METAMATERIALS: PROCEEDINGS OF THE 2018 NIST WORKSHOP - 2018 NIST WORKSHOP - KIRK WILEY P ET AL
AUTHOR AFFILIATION : UNIV OF TEXAS AT ARLINGTON, USA PUB DATE : 12-Sep-19 ONLINE RELEASE DATE
View DetailsCOMPENDIUM OF IN VIVO MONITORING IN REAL-TIME MOLECULAR NEUROSCIENCE - VOLUME 3: PROBING BRAIN FUNCTION, DISEASE AND INJURY WITH ENHANCED OPTICAL AND ELECTROCHEMICAL SENSORS - WILSON GEORGE S ET AL
AUTHOR AFFILIATION : UNIV OF KANSAS, USA PUB DATE : 16-Sep-19 ONLINE RELEASE DATE : 24-Sep-19
View DetailsSOFT NANOMATERIALS - XU BING ET AL
AUTHOR AFFILIATION : BRANDEIS UNIV, USA PUB DATE : 18-Sep-19 ONLINE RELEASE DATE : 18-Sep-19
View DetailsINTRODUCTION TO COMPUTER SIMULATIONS FOR INTEGRATED STEM COLLEGE EDUCATION - HAFEZ MOHAMED & TAVERNETTI WILLIAM
AUTHOR AFFILIATION : UNIV OF CALIFORNIA, DAVIS, USA PUB DATE : 23-Sep-19 ONLINE RELEASE DATE :
View DetailsHANDBOOK OF SYNTHETIC METHODOLOGIES AND PROTOCOLS OF NANOMATERIALS (IN 4 VOLUMES) - YIN YADONG
AUTHOR AFFILIATION : UNIV OF CALIFORNIA, RIVERSIDE, USA PUB DATE : 13-Aug-19 ONLINE RELEASE DA
View DetailsSECURECSOCIAL: SECURE CLOUD-BASED SOCIAL NETWORK - ATREY PRADEEP K ET AL
AUTHOR AFFILIATION : UNIV OF ALBANY, STATE UNIV OF NEW YORK, USA PUB DATE : 19-Aug-19 ONLINE R
View DetailsHYSTERESIS AND NEURAL MEMORY - MAYERGOYZ ISAAK ET AL
AUTHOR AFFILIATION : UNIV OF MARYLAND, USA PUB DATE : 20-Aug-19 ONLINE RELEASE DATE : 23-Aug-1
View DetailsMORSE THEORY OF GRADIENT FLOWS, CONCAVITY AND COMPLEXITY ON MANIFOLDS WITH BOUNDARY - KATZ GABRIEL
AUTHOR AFFILIATION : MASSACHUSETTS INST OF TECHNOLOGY, USA PUB DATE : 21-Aug-19 ONLINE RELEASE
View DetailsPSYCHOLOGY OF PROBLEM SOLVING, THE: THE BACKGROUND TO SUCCESSFUL MATHEMATICS THINKING - VIRGADAMO DANIELLE SAURO ET AL
AUTHOR AFFILIATION : LONG ISLAND UNIV, USA PUB DATE : 21-Aug-19 ONLINE RELEASE DATE : 22-Aug-1
View DetailsCHEMICAL KINETICS: BEYOND THE TEXTBOOK - LINDENBERG KATJA ET AL
AUTHOR AFFILIATION : UNIV OF CALIFORNIA AT SAN DIEGO, USA PUB DATE : 27-Aug-19 ONLINE RELEASE
View DetailsENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET) - BAR-COHEN AVRAM ET AL
AUTHOR AFFILIATION : UNIV OF MARYLAND, USA PUB DATE : 27-Aug-19 ONLINE RELEASE DATE : 28-Aug-1
View DetailsHIGH PERFORMANCE LOGIC AND CIRCUITS FOR HIGH-SPEED ELECTRONIC SYSTEMS - JAIN F ET AL
AUTHOR AFFILIATION : UNIV OF CONNECTICUT, USA PUB DATE : 27-Jun-19 ONLINE RELEASE DATE : 4-Jul
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