ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET) - BAR-COHEN AVRAM ET AL

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ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET) - BAR-COHEN AVRAM ET AL

AUTHOR AFFILIATION : UNIV OF MARYLAND, USA PUB DATE : 27-Aug-19 ONLINE RELEASE DATE : 28-Aug-19 Print ISBN 13 : 9789811201110 US$ (Print) : 1350 EISBN 13 : 9789811209635 US$ (Ebook) : 2160 £ (Ebook) : 1985 SUBJECT : ENGINEERING / ACOUSTICS SUB SUBJECT : ELECTRICAL & ELECTRONIC ENGINEERING IMPRINT : WSPC Package : WSPC Collection Year : 2019 URL : https://www.worldscientific.com/worldscibooks/10.1142/11303#t=toc BOOK TYPE : HANDBOOK PP : 1080 BOOK CODE : 11303

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print ebook subject engineering materials processes packaging mechanics encyclopedia 11303

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