Category: 11303
ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET) - BAR-COHEN AVRAM ET AL
AUTHOR AFFILIATION : UNIV OF MARYLAND, USA PUB DATE : 27-Aug-19 ONLINE RELEASE DATE : 28-Aug-1
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