Category: electronic
SENSORS AND ACTUATORS - ALEGRIA FRANCISCO ANDRE CORREA
AUTHOR AFFILIATION : INST SUPERIOR TECNICO, UNIV OF LISBON, PORTUGAL & INST DE TELECOMUNICACOES, POR
View DetailsNANOTECHNOLOGY FOR ELECTRONICS, BIOSENSORS, ADDITIVE MANUFACTURING AND EMERGING SYSTEMS APPLICATIONS - JAIN F ET AL
AUTHOR AFFILIATION : UNIV OF CONNECTICUT, USA PUB DATE : 22-Jun-21 ONLINE RELEASE DATE : 30-Ju
View DetailsPULSE WIDTH MODULATION IN POWER ELECTRONICS - MAYERGOYZ ISAAK & TYAGI SIDDHARTH
AUTHOR AFFILIATION : UNIV OF MARYLAND, USA PUB DATE : 5-May-21 ONLINE RELEASE DATE : 18-May-21
View DetailsELECTRONIC PROPERTIES OF DIRAC AND WEYL SEMIMETALS - GORBAR EDUARD V ET AL
AUTHOR AFFILIATION : TARAS SHEVCHENKO NATIONAL KIEV UNIV, UKRAINE PUB DATE : 4-Jan-21 ONLINE R
View DetailsNANOTECHNOLOGY FOR ELECTRONICS, PHOTONICS, BIOSENSORS, AND EMERGING TECHNOLOGIES - JAIN F ET AL
AUTHOR AFFILIATION : UNIV OF CONNECTICUT, USA PUB DATE : 4-Aug-20 ONLINE RELEASE DATE : 21-Aug
View DetailsCOMPENDIUM ON ELECTROMAGNETIC ANALYSIS - FROM ELECTROSTATICS TO PHOTONICS: FUNDAMENTALS AND APPLICATIONS FOR PHYSICISTS AND ENGINEERS (IN 5 VOLUMES) - TSUKERMAN IGOR
AUTHOR AFFILIATION : THE UNIV OF AKRON, USA PUB DATE : 15-Jun-20 ONLINE RELEASE DATE : 23-Jun-
View DetailsGUIDE TO SEMICONDUCTOR ENGINEERING - RUZYLLO JERZY
AUTHOR AFFILIATION : THE PENNSYLVANIA STATE UNIV, USA PUB DATE : 10-Mar-20 ONLINE RELEASE DATE
View DetailsCOMPUTING AND OPTIMIZATION FOR DC POWER SYSTEMS OF ELECTRIC TRANSPORT - BOSYI DMYTRO, SABLIN OLEH & KOSARIEV YEVHEN
AUTHOR AFFILIATION : DNIPRO NATIONAL UNIV, UKRAINE PUB DATE : 18-Feb-20 ONLINE RELEASE DATE :
View DetailsIAENG TRANSACTIONS ON ENGINEERING SCIENCES: SPECIAL ISSUE FOR THE INTERNATIONAL ASSOCIATION OF ENGINEERS CONFERENCES 2019 - AO SIO-LONG ET AL
AUTHOR AFFILIATION : INT'L ASSOC OF ENGINEERS, HONG KONG PUB DATE : 8-Jan-20 ONLINE RELEASE DA
View DetailsWIDE BANDGAP SEMICONDUCTOR ELECTRONICS AND DEVICES - SINGISETTI UTTAM ET AL
AUTHOR AFFILIATION : UNIV OF BUFFALO, USA PUB DATE : 10-Dec-19 ONLINE RELEASE DATE : 10-Dec-19
View DetailsENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET) - BAR-COHEN AVRAM ET AL
AUTHOR AFFILIATION : UNIV OF MARYLAND, USA PUB DATE : 27-Aug-19 ONLINE RELEASE DATE : 28-Aug-1
View DetailsHIGH PERFORMANCE LOGIC AND CIRCUITS FOR HIGH-SPEED ELECTRONIC SYSTEMS - JAIN F ET AL
AUTHOR AFFILIATION : UNIV OF CONNECTICUT, USA PUB DATE : 27-Jun-19 ONLINE RELEASE DATE : 4-Jul
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