Category: process
TELEGEOPROCESSING - XUE YONG ET AL
AUTHOR AFFILIATION : CHINA UNIV OF MINING AND TECHNOLOGY, CHINA PUB DATE : 19-Jan-23 ONLINE RE
View DetailsSTUDIES OF CLOUD, CONVECTION AND PRECIPITATION PROCESSES USING SATELLITE OBSERVATIONS - ROSSOW WILLIAM B ET AL
AUTHOR AFFILIATION : - PUB DATE : 26-Oct-22 ONLINE RELEASE DATE : 5-Dec-22 Print ISBN 13 :
View DetailsMYSTERY OF TIME, THE: ASYMMETRY OF TIME AND IRREVERSIBILITY IN THE NATURAL PROCESSES - KUZEMSKY ALEXANDER L
AUTHOR AFFILIATION : JOINT INST FOR NUCLEAR RESEARCH, RUSSIA PUB DATE : 14-Oct-22 ONLINE RELEA
View DetailsCOMPUTATIONAL INTELLIGENCE AND IMAGE PROCESSING IN MEDICAL APPLICATIONS - CHEN CHI HAU
AUTHOR AFFILIATION : UNIV OF MASSACHUSETTS DARTMOUTH, USA PUB DATE : 30-May-22 ONLINE RELEASE
View DetailsDESIGN AND DEVELOPMENT OF A WIKI-BASED COLLABORATIVE PROCESS WRITING PEDAGOGY: PUTTING TECHNOLOGICAL, PEDAGOGICAL, AND CONTENT KNOWLEDGE (TPACK) IN ACTION - LI XUANXI
AUTHOR AFFILIATION : HUZHOU UNIV, CHINA PUB DATE : 5-Jan-22 ONLINE RELEASE DATE : 27-Jan-22
View DetailsHILBERT AND BANACH SPACE-VALUED STOCHASTIC PROCESSES - KAKIHARA YUICHIRO
AUTHOR AFFILIATION : CALIFORNIA STATE UNIV, SAN BERNARDINO, USA PUB DATE : 29-Jul-21 ONLINE RE
View DetailsSTOCHASTIC PROCESSES: HARMONIZABLE THEORY - RAO MALEMPATI MADHUSUDANA
AUTHOR AFFILIATION : UNIV OF CALIFORNIA, RIVERSIDE, USA PUB DATE : 21-Sep-20 ONLINE RELEASE DA
View DetailsTHERMAL FLUCTUATIONS AND RELAXATION PROCESSES IN NANOMAGNETS - COFFEY WILLIAM T ET AL
AUTHOR AFFILIATION : TRINITY COLLEGE DUBLIN, IRELAND PUB DATE : 21-May-20 ONLINE RELEASE DATE
View DetailsPHYSICAL FOUNDATIONS OF HYDRODYNAMIC PROCESSES, THE: MACROSCOPIC AND KINETIC APPROACHES - CHECHETKIN VALERY M & FIMIN NIKOLAY N
AUTHOR AFFILIATION : KELDYSH INST OF APPLIED MATHEMATICS, RUSSIA PUB DATE : 19-Mar-20 ONLINE R
View DetailsUNDERSTANDING VOLTAMMETRY: SIMULATION OF ELECTRODE PROCESSES (SECOND EDITION) - COMPTON RICHARD G ET AL
AUTHOR AFFILIATION : UNIV OF OXFORD, UK PUB DATE : 25-Feb-20 ONLINE RELEASE DATE : 27-Feb-20
View DetailsENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET) - BAR-COHEN AVRAM ET AL
AUTHOR AFFILIATION : UNIV OF MARYLAND, USA PUB DATE : 27-Aug-19 ONLINE RELEASE DATE : 28-Aug-1
View DetailsPROGRESS, PIONEERS AND PROCESS: STUDIES IN PHYSIOLOGY AND GENETIC MEDICINE - SMITH MOYRA
AUTHOR AFFILIATION : UNIV OF CALIFORNIA, IRVINE, USA PUB DATE : 12-Dec-18 ONLINE RELEASE DATE
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