Category: mechani
MULTISCALE OPTIMIZATION AND MATERIALS DESIGN - YAN JUN & CHENG GENGDONG
AUTHOR AFFILIATION : DALIAN UNIV OF TECHNOLOGY, CHINA PUB DATE : 29-Dec-20 ONLINE RELEASE DATE
View DetailsQUANTUM UNIVERSE, THE: ESSAYS ON QUANTUM MECHANICS, QUANTUM COSMOLOGY, AND PHYSICS IN GENERAL - HARTLE JAMES B
AUTHOR AFFILIATION : UNIV OF CALIFORNIA, SANTA BARBARA, USA PUB DATE : 4-Jan-21 ONLINE RELEASE
View DetailsSOIL MECHANICS - LIAO HONGJIAN ET AL
AUTHOR AFFILIATION : XI'AN JIAOTONG UNIV, CHINA PUB DATE : 24-Sep-20 ONLINE RELEASE DATE : 24-
View DetailsMECHANICS OF PIEZOELECTRIC STRUCTURES (SECOND EDITION) - YANG JIASHI
AUTHOR AFFILIATION : UNIV OF NEBRASKA-LINCOLN, USA PUB DATE : 18-Sep-20 ONLINE RELEASE DATE :
View DetailsLECTURE NOTES ON MECHANICS: INTERMEDIATE LEVEL - CHEW LOCK YUE & CHIA ELBERT EE MIN
AUTHOR AFFILIATION : NTU, S'PORE PUB DATE : 20-Jul-20 ONLINE RELEASE DATE : 31-Jul-20 Print
View DetailsQUANTUM MECHANICS IN POTENTIAL REPRESENTATION AND APPLICATIONS - JANAVICIUS ARVYDAS JUOZAPAS & JURGAITIS DONATAS
AUTHOR AFFILIATION : SIAULIAI UNIV, LITHUANIA PUB DATE : 21-Jul-20 ONLINE RELEASE DATE : 21-Au
View DetailsSTATISTICAL MECHANICS AND SCIENTIFIC EXPLANATION: DETERMINISM, INDETERMINISM AND LAWS OF NATURE - ALLORI VALIA
AUTHOR AFFILIATION : NORTHERN ILLINOIS UNIV, USA PUB DATE : 22-Apr-20 ONLINE RELEASE DATE : 22
View DetailsFUZZY SYSTEMS TO QUANTUM MECHANICS - LI HONG-XING
AUTHOR AFFILIATION : BEIJING NORMAL UNIV, ZHUHAI, CHINA PUB DATE : 10-Mar-20 ONLINE RELEASE DA
View DetailsCELL MECHANICS AND TUMOR DEVELOPMENT - HUSTON RONALD L
AUTHOR AFFILIATION : UNIV OF CINCINNATI, USA PUB DATE : 18-Feb-20 ONLINE RELEASE DATE : 20-Feb
View DetailsADVANCED CONTINUUM THEORIES AND FINITE ELEMENT ANALYSES - LEE JAMES D ET AL
AUTHOR AFFILIATION : THE GEORGE WASHINGTON UNIV, USA PUB DATE : 8-Jan-20 ONLINE RELEASE DATE :
View DetailsFROM CLASSICAL MECHANICS TO QUANTUM FIELD THEORY, A TUTORIAL - ERCOLESSI ELISA ET AL
AUTHOR AFFILIATION : UNIV DI BOLOGNA, ITALY & INFN-SEZIONE DI BOLOGNA, ITALY PUB DATE : 14-Jan-20
View DetailsENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET) - BAR-COHEN AVRAM ET AL
AUTHOR AFFILIATION : UNIV OF MARYLAND, USA PUB DATE : 27-Aug-19 ONLINE RELEASE DATE : 28-Aug-1
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