AUTHOR AFFILIATION : NATIONAL CHENG KUNG UNIV, TAIWAN
PUB DATE : 13-Jul-18
ONLINE RELEASE DATE : 16-Jul-18
Print ISBN 13 : 9789813237605
US$ (Print) : 148
EISBN 13 : 9789813238206
US$ (Ebook) : 237
£ (Ebook) : 220
SUBJECT : MATERIALS SCIENCE
SUB SUBJECT : MICROELECTRONICS
IMPRINT : WSPC
Package : WSPC
Collection Year : 2018
URL : https://www.worldscientific.com/worldscibooks/10.1142/10921#t=toc
WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING
BOOK TYPE : MONOGRAPH
PP : 388
BOOK CODE : 10921