AUTHOR AFFILIATION : HIROSHIMA UNIV, JAPAN
PUB DATE : 3-Jun-08
ONLINE RELEASE DATE : 22-Sep-09
Print ISBN 13 : 9789812568649
US$ (Print) : 137
EISBN 13 : 9789812812056
US$ (Ebook) : 219
£ (Ebook) : 195
SUBJECT : ENGINEERING / ACOUSTICS
SUB SUBJECT : CIRCUITS & SYSTEMS
IMPRINT : WSPC
Package : WSPC
Collection Year : 2008
URL : https://www.worldscientific.com/worldscibooks/10.1142/6159#t=toc
INTERNATIONAL SERIES ON ADVANCES IN SOLID STATE ELECTRONICS AND TECHNOLOGY
BOOK TYPE : MONOGRAPH
PP : 380
BOOK CODE : 6159