MEMS PACKAGING - LEE YUNG-CHENG ET AL

Business Listing - October 16, 2023

MEMS PACKAGING - LEE YUNG-CHENG ET AL

AUTHOR AFFILIATION : UNIV OF COLORADO, USA PUB DATE : 3-Jan-18 ONLINE RELEASE DATE : 21-Dec-17 Print ISBN 13 : 9789813229358 US$ (Print) : 148 EISBN 13 : 9789813229365 US$ (Ebook) : 237 £ (Ebook) : 220 SUBJECT : ENGINEERING / ACOUSTICS SUB SUBJECT : ELECTRICAL & ELECTRONIC ENGINEERING IMPRINT : WSPC Package : WSPC Collection Year : 2018 URL : https://www.worldscientific.com/worldscibooks/10.1142/10692#t=toc WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING BOOK TYPE : REVIEW VOLUME PP : 364 BOOK CODE : 10692  

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