HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES - CHO J-D ET AL

Business Listing - October 16, 2023

HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES - CHO J-D ET AL

AUTHOR AFFILIATION : SUNG KYUN KWAN UNIV, SOUTH KOREA PUB DATE : 12-Jun-96 ONLINE RELEASE DATE : 13-Aug-10 Print ISBN 13 : 9789810223076 US$ (Print) : 103 EISBN 13 : 9789812830852 US$ (Ebook) : 165 £ (Ebook) : 135 SUBJECT : ENGINEERING / ACOUSTICS SUB SUBJECT : CIRCUITS & SYSTEMS IMPRINT : WSPC Package : WSPC Collection Year : Backlist URL : https://www.worldscientific.com/worldscibooks/10.1142/2793#t=toc SELECTED TOPICS IN ELECTRONICS AND SYSTEMS BOOK TYPE : REVIEW VOLUME PP : 264 BOOK CODE : 2793  

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