DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS - SWAMINATHAN MADHAVAN ET AL

Business Listing - October 16, 2023

DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS - SWAMINATHAN MADHAVAN ET AL

AUTHOR AFFILIATION : GEORGIA INST OF TECHNOLOGY, USA PUB DATE : 5-Nov-13 ONLINE RELEASE DATE : 13-Nov-13 Print ISBN 13 : 9789814508599 US$ (Print) : 137 EISBN 13 : 9789814508605 US$ (Ebook) : 219 £ (Ebook) : 195 SUBJECT : ENGINEERING / ACOUSTICS SUB SUBJECT : ELECTRICAL & ELECTRONIC ENGINEERING IMPRINT : WSPC Package : WSPC Collection Year : 2013 URL : https://www.worldscientific.com/worldscibooks/10.1142/8814#t=toc WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING BOOK TYPE : MONOGRAPH (TREAT AS TEXTBOOK) PP : 380 BOOK CODE : 8814  

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