AUTHOR AFFILIATION : UNIV OF TECHNOLOGY DRESDEN, GERMANY & UNIV OF CALIFORNIA SAN DIEGO, CA, USA
PUB DATE : 25-Nov-10
ONLINE RELEASE DATE : 28-Feb-11
Print ISBN 13 : 9789814273213
US$ (Print) : 271
EISBN 13 : 9789814273220
US$ (Ebook) : 434
£ (Ebook) : 380
SUBJECT : ENGINEERING / ACOUSTICS
SUB SUBJECT : CIRCUITS & SYSTEMS
IMPRINT : WSPC
Package : WSPC
Collection Year : 2010
URL : https://www.worldscientific.com/worldscibooks/10.1142/7257#t=toc
INTERNATIONAL SERIES ON ADVANCES IN SOLID STATE ELECTRONICS AND TECHNOLOGY
BOOK TYPE : MONOGRAPH
PP : 752
BOOK CODE : 7257